Tag Archives: Hardware design services

Android Media Player Dongle

Qmax Systems India Pvt Ltd offers the Android Media player dongle which is suitable in particular for ambitious newcomers who are looking for an inexpensive, diverse world of multimedia technology, without compromising highly innovative features and highest quality standards. For a digital all-rounder, Qmax systems have made  Android Media player dongle which  comes in series with the functions of a DVB-receiver, a media player, a multimedia server & client – all of these features being highly user-friendly.

Android Media player dongle (Android hardware development) comes in four different stylish casing designs, all being highly flexible- a single tuner model (DVB-C or DVB-T) comes with delivery – and as an introductory bonus retailers placing their first order of the Android Media player dongle receive two DVB-S-tuners for the price of one!

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Features:

If customers’ demands increase, simply add elements, for example by installing a hard drive to create a personal video recorder. You can select from virtually all common optical drives available – from a simple DVD-Rom to a dual-layer burner – anything is connectable. A free slot is available to add a tuner module of choice. ( Embedded Product development )You can upgrade your Android Media player dongle with Twin-tuners to receive up to four programs via four different satellite transponders. Or take the Android Media player dongle to your vacation domicile. Through the ability to adapt to satellite, cable or terristric reception – you are geared for all possible forms of reception – all with just one device.

For Pc-Pros looking for an individually created media center solution, the Android Media player dongle is ideal: previously owned existing large storage devices or DVD-burners do not have to be replaced. ( Hardware design services ) The installation of additional components becomes easy as 1-2-3, thanks to the user-friendly casing structure.

A variety of interchangeable displays in trendy color combinations ensures more individual expression, which is particularly attractive for so called case-modders.

And to assure easy communication with other home entertainment devices networked to the Android Media player dongle a Mini-PCI-base comes included in delivery – by adding the WLAN accessory, the Android Media player dongle  is also able to communicate within cordless networks.

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Copper Pouring

The POLYGON command enables you to define areas which belong to a signal, connecting all of the related pads to this signal with thermal symbols. Such a signal retains a user-defined distance to any other signal path.

You can PCB design layers that contain multiple polygons such as different ground areas, and you can design polygons on multiple layers.

To demonstrate this feature of EAGLE, let’s fill the Top layer of a board with the GND signal. Reload the board demo2.brd once again, enlarge the window, and ripup the GND signal:

RIPUP GND ←

Use the DISPLAY command to switch on the layer 1Top, 17 Pads, 18 Vias, and 20 Dimension. (PCB Design Services) Use the button None, in the menu, to switch off the display of all other layers first.

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Click the POLYGON icon in the command toolbar and type:

GND ←

to provide the name GND for the polygon to be defined. Only then will it belong to the GND signal.

Select the LayerTop from the combo box in the parameter toolbar. Then:

• left hand upper corner of the board outlines,

• right hand upper corner,

• right hand lower corner,

• • left hand lower corner.

The double click closes the polygon.

To start the calculation of the filled area, click the RATSNEST icon.

Since this is a very complex operation it can take some time.

As before, the pads belonging to the GND signal are connected with thermal symbols. Check this with:

SHOW GND ←

In this case everything shown in the layer color is copper, since this layer is not plotted inversely (only supply layers defined with $name).

After a board has been loaded, polygons are displayed with their outlines. PCB CAD Services filled areas are displayed only after the RATSNEST command has been executed. Inversely, the RIPUP command and a single click on the edge of a polygon results in the outline display of this particular polygon.

 

PCB Documentation

The PCB’s documents should include the hardware dimensional drawings, schematic, BOM, layout file, component placement file, assembly drawings and instructions, and Gerber file set. User guides also are useful but aren’t required. PCB Design Gerber file set is PCB jargon for the output files of the layout that are used by PCB manufacturers to create the PCB. A complete set of Gerber files includes output files generated from the board layout file:

  • Silkscreen top and bottom
  • Solder mask top and bottom
  • All metal layers
  • Paste mask top and bottom
  • Component map (X-Y coordinates)
  • Assembly drawing top and bottom
  • Drill file
  • Drill legend
  • FAB outline (dimensions, special features)
  • Netlist file

The special features included in the FAB outline include but are not limited to notches, cutouts, bevels, back-filled vias-in-pad (used for BGA-type IC packages that have an array of pins under the device), blind/buried vias, surface finish and leveling, hole tolerances, layer count, and more.

Schematic Details

Schematics control the project, so accuracy and completeness are critical for success. PCB Design Services include information that is necessary for the proper operation of the circuit. A schematic should include adequate design details, such as pin numbers, names, component values, and ratings.

Embedded within each schematic symbol is the manufacturer part number used to determine price and specifications. The package specification determines the size of the footprint for each component. The first step should be to make sure the exposed copper for each pin is in the proper location and is slightly larger than the component pins (3 to 20 mils) depending on available area and soldering method.

 

Consider assembly when designing footprints, and follow the manufacturer’s recommended PCB CAD services footprint. Some components come in microscopic packages and do not allow room for extra copper. Even in these cases, a stripe of 2.5 to 3 mils of solder mask should be applied between every pin on the board.

Follow the rule of 10. Small vias have a finished hole size of 10 mils with 10 additional mils of pad ring. Traces should be 10 mils or further from the edge of the board. Trace-to-trace pitch is 10 mils (5-mil air-gap, 5-mil trace width, 1-oz copper). Vias with 40-mil diameter holes or larger should have a pad ring added for reliability. An additional 15 to 25 mils of clearance beyond the design rule should be instated for copper planes on outer layers from plane to pins. This reduces the risk of solder bridging at all solder points.

Component Placement

Component placement is next in the process and determined based on thermal management, function, and electrical noise considerations. PCB Service Bureau first-pass component placement step commences after the outline of component and interconnect position has been assigned. Immediately after the individual components are placed, a placement review should be held and adjustments made to facilitate routing and optimize performance.

Placement and package sizes are often reconsidered and changes are made at this point based on size and cost. Components absorbing greater than 10 mW or conducting more than 10 mA should be considered powerful enough for additional thermal and electrical considerations. Sensitive signals should be shielded from noise sources with planes and be kept impedance-controlled.  

Power management components should utilize ground planes or power planes for heat flow. Make high-current connections according to the acceptable voltage drop for the connection. Layer transitions for high current paths should be made with two to four vias at each layer transition.Place multiple vias at layer transitions to increase reliability, reduce resistive and inductive losses, and improve thermal conductivity.